How to Swap iPhone Motherboard || Motherboard Swapping

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When your iPhone’s motherboard breaks down completely। water damage,motherboard circuit damage for example,you need to swap the motherboard chips to make your iPhone back to work.swap motherboard requires certain skills and corresponding tools to complete.in this blog we demonstrate how to use motherboard repair tools to swap iPhone motherboard chips while save the old data.

Tools and materials:

  • solder
  • motherboard fixture holder
  • microscope
  • hot air gun
  • glue removal knife
  • no.16 knife
  • tweezers
  • soft brush
  • solder flux paste
  • solder flux paste
  • soldering iron
  • pcb cleaner
  • cleanroom wipes
  • desoldring braid/ solder wick
  • bga soldering stencil
  • scrape knife
  • solder paste
  • dc power supply
  • nand read/write programmer
  • chip non-removal/write programmer

Dissemble and clean chips:

please be careful to choose the logic board grinder u see, as its quality directly affect subsequent operation. a good logic board grinder helps you to get twicw the result with half the effort.

place the motherboard on the motherboard fixture holder.use the hot air gun and glue removal knife to gently clean up the sticker on the cpu under the microscope.

Carefully take off the main cpu after removing the sticker. use the hot air gun and knife blade to take off the baseband cpu. then take off the nand and logic eeprom chip as well.

add solder flux on the nand ,then clen up nand sticker with the soldering iron. then desoder the nand with the solder wick. clean off the nand with pcb cleaner. add solder flux on the baseband cpu sticker with the soldering iron. use the pcb clean the baseband cpu as well .next, add solder flux in the main cpu, then desolder the main cpu with the soldering iron. use a scrape knife to clean off the sticker on the main cpu. finally ,finish of the main cpu cleaning with a soft brush.

Reball The Chips

Use the reballing platform to reball the main cpu. make sure align the main cpu with with the ga reballing stencil well .apply the solder paste evently on the reballing sencil ,wipe off the suplus solder paste if necessary.

heat and melt the solder paste with the hot air gun. heat and melt the solder paste with the hot air gun. when the solder paste solidifies ,separate the reballing stencil from the main cpu. main cpu realling completed.

place the nand on a paper towel. align the nand with the BGA reballing stencil. USE THE scrape knife to apply the solder paste on the reballing stencil evenly wipe off the surplus solder paste. heat and melt the solder paste with hot aie gun, separate the nand from the reballing stencil when the solder paste is solidified. NAND reballing completed.

next , place the baseband cpu on a paper towel. due to there are several black spots on the baseband cpu ,apply some solder paste and use the soldering iron to polish the solder pads. align the baseband cpu with the revalling stencil ,apply solder paste ,wipe the surplus solder paste.

heat and melt the solder paste with the hot air gun. separate the baseband cpu from the reballling stencil when the solder paste is solidified. baseband cpu reballing completed.

finally, place the logic EEPROM chip on a paper towel. align the logic eeprom chip with the reballing stencil,apply the solder paste ad wipe off the surplus solder paste.

Reassemble and Test

Prepare a new motherboard ,which has pre-removed the nand , main cpu, baseband cpu and logic eeprom chip. add solder flux , use the hot air gun to reassmble the logic eeprom chip on the new motherboard.

place the nand on the nand read /write programmer. place the nand on the nand read/writer programmer. unbind the wifi. after wifi unbinding ,take off the nand and repare for installation. next ,add solder flux on the new motherboard nand solder pads. next ,add solder flux on the new motherboard nand solder pads.

use the hot air gun to assemble the nand on the new motherboard. cool down for 5 minutes. use the chip programmer helps to write the baseband eeprom chip data in the new motherboard. use the chip programmer helps to write the baseband eeprom chip data in the new motherboard.

measue whether the motherboard current is normal after transferring the baseband eeprom chip data. current showed normal,, no motherboard short discovered. add solder flux on the new motherboard baseband cpu solder pads , then align the baseband cpu.

solder the baseband cpu with the hot air gun. add solder flux on the new motherboard main cpu solder pads ,then align the main cpu. solder the main cpu with the hot air gun. cool down for 5 minutes.

buckle the motherboard with a display assembly, connect to the dc power supply and boot up. iphone boots up properly , motherboard swapping completed. iphone boots up properly, motherboard swapping completed.

Disclaimer

to swap the motherboard while preserving the old data. the old nand , logic eeprom chip, main cpu and baseband cpu are all need to be reassembled to the new motherboard , at the meantime , we also need to write the baseband eeprom chip data in the new motherboard. and unbind the wifi for the nand, for skilled technician. you may change the chip installation steps as you wish.